Patent Assignment
Reel/Frame 037373/0848
Assignment of Assignor's Interest
Recorded: 2015-12-29
Pages: 3
Assignor
GUO, LIANG LIANG
Executed: 2015-12-06
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Wafer Level Packaging Approach for Semiconductor Devices