Patent Assignment
Reel/Frame 037377/0312
Assignment of Assignor's Interest
Recorded: 2015-12-29
Pages: 6
Assignors
LIANG, STEVE XIN
Executed: 2015-12-14
LIANG, CHIH-CHUNG
Executed: 2015-12-17
LIN, YU-BIN
Executed: 2015-12-11
WANG, YAQIN
Executed: 2015-12-17
ZHANG, YOUHAI
Executed: 2015-12-17
Assignee
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
NO. 78 CHANGSHAN RD., JIANGYIN WUXI, JIANGSU, 214434, CHINA
Covered Property
(1)
Etching-Before-Packaging Horizontal Chip 3D System-Level Metal Circuit Board Structure and Technique Thereof