Patent Assignment
Reel/Frame 037391/0674
Assignment of Assignor's Interest
Recorded: 2015-12-31
Pages: 4
Assignors
CHEN, LU-YI, MR.
Executed: 2015-06-17
LU, CHANG-LUN, MR.
Executed: 2015-06-17
CHEN, SHIH-CHING, MR.
Executed: 2015-06-17
MA, GUANG-HWA, MR.
Executed: 2015-06-17
HSIAO, CHENG-HSU, MR.
Executed: 2015-06-17
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Package Structure and Fabrication Method Thereof