Patent Assignment
Reel/Frame 037399/0778
Assignment of Assignor's Interest
Recorded: 2016-01-04
Pages: 4
Assignors
PAN, KUO LUNG
Executed: 2015-12-24
LIU, CHUNG-SHI
Executed: 2015-12-24
TSAI, HAO-YI
Executed: 2015-12-24
CHEN, YU-FENG
Executed: 2015-12-24
CHENG, YU-JEN
Executed: 2015-12-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method of Forming Same