Patent Assignment
Reel/Frame 037411/0142
Assignment of Assignor's Interest
Recorded: 2016-01-05
Pages: 3
Assignors
CHENG, TAI-SHIN
Executed: 2015-12-29
CHANG, CHE-CHENG
Executed: 2015-12-29
CHEN, WEI-TING
Executed: 2015-12-29
SHIAO, WEI-YIN
Executed: 2015-12-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Cleaning via of Interconnect Structure of Semiconductor Device Structure