Patent Assignment
Reel/Frame 037432/0074
Assignment of Assignor's Interest
Recorded: 2016-01-07
Pages: 4
Assignors
GROENHUIS, ROELF A.J.
Executed: 2013-12-04
LAM, KAN WAE
Executed: 2013-12-04
LLOYD, CLIFFORD J.
Executed: 2013-12-04
WAN, CHI HOO
Executed: 2013-12-06
WONG, FEI YING
Executed: 2013-12-06
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656, NETHERLANDS
Covered Property
(1)
Packaged Semiconductor Device with Interior Polygonal Pads
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 11, 2017
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 042978/0873 →
Corrective Assignment to Correct the Add Omitted Page 2 of 4 to the Assignment Agreement Previously Recorded on Reel 042978 Frame 0873. Assignor(S) Hereby Confirms the Assignment.
Jul 12, 2017
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 043177/0119 →