Patent Assignment
Reel/Frame 037435/0254
Assignment of Assignor's Interest
Recorded: 2016-01-08
Pages: 4
Assignors
CHANG, CHE-CHENG
Executed: 2015-12-30
LIN, CHIH-HAN
Executed: 2015-12-30
TSENG, HORNG-HUEI
Executed: 2016-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Contact Structures, Finfet Devices and Methods of Forming the Same