Patent Assignment
Reel/Frame 037463/0033
Assignment of Assignor's Interest
Recorded: 2016-01-12
Pages: 3
Assignors
CHAPMAN, PHILLIP F.
Executed: 2013-02-01
COLLINS, DAVID S.
Executed: 2013-02-01
VOLDMAN, STEVEN H.
Executed: 2013-02-01
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Structure and Method of Latchup Robustness with Placement of Through Wafer via Within Cmos Circuitry