IP Library › Assignment 037468/0312
Patent Assignment
Reel/Frame 037468/0312

Assignment of Assignor's Interest

Recorded: 2016-01-12 Pages: 4
Assignors
HO, KUAN-LIN
Executed: 2015-12-18
CHEN, CHIN-LIANG
Executed: 2015-12-18
YU, CHI-YANG
Executed: 2015-12-18
LIU, YU-CHIH
Executed: 2015-12-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Lid Structure for a Semiconductor Device Package and Method for Forming the Same
Patent: 9,812,410 →
Application: 14/985,504 →
Publication: US 2017/0194268
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →