Patent Assignment
Reel/Frame 037469/0894
Assignment of Assignor's Interest
Recorded: 2016-01-12
Pages: 3
Assignors
LIN, YU-HUNG
Executed: 2015-12-26
LIU, CHI-WEN
Executed: 2015-12-26
TSENG, HORNG-HUEI
Executed: 2016-01-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Interconnection Structure, Fabricating Method Thereof, and Semiconductor Device Using the Same