IP Library Assignment 037493/0461
Patent Assignment
Reel/Frame 037493/0461

Assignment of Assignor's Interest

Recorded: 2016-01-14 Pages: 13
Assignors
SHINH, GURPREET
Executed: 2013-10-24
TEMPLETON, DONALD E.
Executed: 2015-12-18
SCHIECK, BRIAN S.
Executed: 2015-12-03
WAIZMAN, ALEX
Executed: 2013-10-24
Assignee
NVIDIA CORPORATION
2701 SAN TOMAS EXPRESSWAY, SANTA CLARA, CALIFORNIA, 94087
Covered Property (1)
Low-Impedance Power Delivery for a Packaged Die
Patent: 9,190,396 →
Application: 13/443,762 →
Publication: US 2014/0042637