Patent Assignment
Reel/Frame 037493/0899
Assignment of Assignor's Interest
Recorded: 2016-01-14
Pages: 6
Assignors
KUO, SHUN MEEN
Executed: 2014-04-21
HART, PAUL R.
Executed: 2014-04-21
SZYMANOWSKI, MARGARET A
Executed: 2014-04-21
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, LAW DEPARTMENT, AUSTIN, TEXAS, 78735
Covered Property
(1)
Semiconductor Packages Having Wire Bond Wall to Reduce Coupling
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to the Security Agreement
Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Change of Name
Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040626 Frame: 0683. Assignor(S) Hereby Confirms the Merger and Change of Name Effective November 7, 2016.
Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
Release of Security Interest
Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →