Patent Assignment
Reel/Frame 037505/0852
Assignment of Assignor's Interest
Recorded: 2016-01-17
Pages: 6
Assignors
CHOI, JUNG-HUN
Executed: 2015-09-07
EOM, DA-IL
Executed: 2015-09-07
LEE, SUN-JUNG
Executed: 2015-09-07
JANG, SUNG-UK
Executed: 2015-09-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same