Patent Assignment
Reel/Frame 037506/0004
Assignment of Assignor's Interest
Recorded: 2016-01-18
Pages: 5
Assignors
NIESSNER, MARTIN RICHARD
Executed: 2015-12-21
HARTNER, WALTER
Executed: 2015-12-16
HAUBNER, GERHARD
Executed: 2015-12-16
PAHLKE, SEBASTIAN
Executed: 2015-12-16
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Chip carrier laminate with high frequency dielectric and thermomechanical buffer