Patent Assignment
Reel/Frame 037513/0344
Assignment of Assignor's Interest
Recorded: 2016-01-13
Pages: 23
Assignors
COLLINS, CHRISTOPHER
Executed: 2015-12-14
FAROOQ, MUKTA G.
Executed: 2015-12-10
GRAVES-ABE, TROY L.
Executed: 2015-12-18
GREENE, BRIAN J.
Executed: 2015-12-23
HANNON, ROBERT
Executed: 2015-12-10
HO, HERBERT L.
Executed: 2015-12-14
KOTHANDARAMAN, CHANDRASEKHARAN
Executed: 2015-12-10
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Implant After Through-Silicon via (Tsv) Etch to Getter Mobile Ions
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.