IP Library › Assignment 037523/0811
Patent Assignment
Reel/Frame 037523/0811

Assignment of Assignor's Interest

Recorded: 2016-01-19 Pages: 11
Assignors
LEE, JONG-JIN
Executed: 2015-11-03
KIM, RAK-HWAN
Executed: 2015-11-03
KIM, BYUNG-HEE
Executed: 2015-11-03
KIM, JIN-NAM
Executed: 2015-11-03
MATSUDA, TSUKASA
Executed: 2015-12-15
PARK, WAN-SOO
Executed: 2015-11-03
LEE, NAE-IN
Executed: 2015-11-03
CHANG, JAE-WON
Executed: 2015-11-03
JUNG, EUN-JI
Executed: 2015-11-03
CHA, JEONG-OK
Executed: 2015-12-07
HWANG, JAE-WON
Executed: 2015-11-03
HWANG, JUNG-HA
Executed: 2015-11-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Forming Wiring Structures Including a Plurality of Metal Layers
Patent: 9,773,699 →
Application: 15/000,302 →
Publication: US 2016/0293484
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Remove the Fifth Conveying Party Data Previously Recorded on Reel 037523 Frame 0811. Assignor(S) Hereby Confirms the Assignment. Feb 26, 2016
From: LEE, JONG-JIN; KIM, RAK-HWAN; KIM, BYUNG-HEE; KIM, JIN-NAM
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 037889/0841 →