Patent Assignment
Reel/Frame 037536/0313
Assignment of Assignor's Interest
Recorded: 2016-01-20
Pages: 3
Assignors
HEUCK, NICOLAS
Executed: 2015-11-18
OTTO, FREDERIK
Executed: 2015-11-18
STEININGER, CHRISTIAN
Executed: 2015-11-19
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Method for Producing a Material-Bonding Connection Between a Semiconductor Chip and a Metal Layer