Patent Assignment
Reel/Frame 037552/0651
Assignment of Assignor's Interest
Recorded: 2016-01-21
Pages: 5
Assignors
PARK, HO-SIK
Executed: 2015-12-10
LEE, DONG-KEUN
Executed: 2015-12-10
CHOI, JAE-HOON
Executed: 2015-12-10
LEE, SANG-JAE
Executed: 2015-12-10
LIM, SUNG-TAEK
Executed: 2015-12-10
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Embedded Printed Circuit Board and Method of Manufacturing the Same