Patent Assignment
Reel/Frame 037552/0700
Assignment of Assignor's Interest
Recorded: 2016-01-21
Pages: 4
Assignors
WEI, WEN-HSIN
Executed: 2016-01-12
WU, CHI-HSI
Executed: 2016-01-13
YU, CHEN-HUA
Executed: 2016-01-15
HU, HSIEN-PIN
Executed: 2016-01-12
HOU, SHANG-YUN
Executed: 2016-01-12
CHEN, WEI-MING
Executed: 2016-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Having Die Structures of Different Heights and Method of Forming Same