IP Library Assignment 037555/0258
Patent Assignment
Reel/Frame 037555/0258

Assignment of Assignor's Interest

Recorded: 2016-01-22 Pages: 5
Assignors
LIN, YU-CHENG
Executed: 2014-07-04
SHIH, HUI-SHEN
Executed: 2014-07-04
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Interlayer Dielectric Layer with Two Tensile Dielectric Layers
Patent: 9,564,507 →
Application: 15/003,813 →
Publication: US 2016/0141383
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →