Patent Assignment
Reel/Frame 037569/0161
Assignment of Assignor's Interest
Recorded: 2016-01-21
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Level Package