Patent Assignment
Reel/Frame 037576/0214
Assignment of Assignor's Interest
Recorded: 2016-01-25
Pages: 4
Assignor
HA, JEONG-KYU
Executed: 2016-01-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Package Modules Using the Same