Patent Assignment
Reel/Frame 037601/0352
Assignment of Assignor's Interest
Recorded: 2016-01-27
Pages: 3
Assignor
LIU, CHIEN-HUNG
Executed: 2016-01-25
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., ZHONGLI DIST., TAOYUAN CITY, 320, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same