Patent Assignment
Reel/Frame 037622/0601
Assignment of Assignor's Interest
Recorded: 2016-01-29
Pages: 4
Assignor
CHUNG, JAE-YUP
Executed: 2015-10-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same