Patent Assignment
Reel/Frame 037633/0039
Assignment of Assignor's Interest
Recorded: 2016-02-01
Pages: 3
Assignors
KUO, CHE-HUNG
Executed: 2016-01-22
CHEN, YING-CHIH
Executed: 2016-01-22
CHOU, CHE-YA
Executed: 2016-01-22
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Assembly with Passive Device