Patent Assignment
Reel/Frame 037649/0746
Assignment of Assignor's Interest
Recorded: 2016-02-02
Pages: 3
Assignors
LIN, YEONG-JYH
Executed: 2016-01-11
TU, YEUR-LUEN
Executed: 2016-01-11
LIANG, CHIN-WEI
Executed: 2016-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Apparatus and Method for Wafer Bonding