Patent Assignment
Reel/Frame 037660/0279
Assignment of Assignor's Interest
Recorded: 2016-02-03
Pages: 5
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Wafer-Level Package Having Multiple Dies Arranged in Side-by-Side Fashion and Associated Yield Improvement Method