Patent Assignment
Reel/Frame 037675/0518
Assignment of Assignor's Interest
Recorded: 2016-02-05
Pages: 6
Assignors
BAEK, JAE-JIK
Executed: 2015-12-23
KWON, KEE-SANG
Executed: 2015-12-23
PARK, SANG-JINE
Executed: 2015-12-23
YOON, BO-UN
Executed: 2015-12-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including a Contact Structure and Methods of Manufacturing the Same