Patent Assignment
Reel/Frame 037682/0666
Assignment of Assignor's Interest
Recorded: 2016-02-02
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Flexible Wing Interconnection Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.