Patent Assignment
Reel/Frame 037725/0726
Assignment of Assignor's Interest
Recorded: 2016-02-12
Pages: 4
Assignor
SEKIYA, KAZUMA
Executed: 2016-01-14
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing System