Patent Assignment
Reel/Frame 037725/0945
Assignment of Assignor's Interest
Recorded: 2016-02-12
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2016-01-26
CHIOU, WEN-CHIH
Executed: 2016-01-26
CHEN, MING-FA
Executed: 2016-01-26
CHEN, YI-HSIU
Executed: 2016-01-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bond Structures and the Methods of Forming the Same