IP Library Assignment 037727/0353
Patent Assignment
Reel/Frame 037727/0353

Assignment of Assignor's Interest

Recorded: 2016-02-12 Pages: 3
Assignor
LEE, DONGSEOK
Executed: 2016-01-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Fin Formation for Semiconductor Device
Application: 15/042,737 →
Publication: US 2017/0236722
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 12, 2016
From: MOREAU, DAVID
To: STMICROELECTRONICS, INC.
Reel/Frame 037727/0333 →
Assignment of Assignor's Interest Feb 12, 2016
From: FAN, SU CHEN; YAMASHITA, TENKO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 037727/0356 →