Patent Assignment
Reel/Frame 037745/0614
Assignment of Assignor's Interest
Recorded: 2016-02-16
Pages: 5
Assignors
OH, SEUNG-HYUN
Executed: 2016-02-16
KIM, PYOUNG-GUG
Executed: 2016-02-15
CHO, YUN-GEON
Executed: 2016-02-16
MIN, CHUN-KI
Executed: 2016-02-16
CHOI, CHUL-YEUN
Executed: 2016-02-16
JUNG, DAE-GIL
Executed: 2016-02-16
Assignee
LUMENS CO., LTD.
12, WONGOMAE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Improved Chip-on-Board Type Light Emitting Device Package and Such Manufactured Chip-on- Board Type Light Emitting Device Package