Patent Assignment
Reel/Frame 037756/0009
Assignment of Assignor's Interest
Recorded: 2016-02-17
Pages: 2
Assignors
HU, YU-HSIANG
Executed: 2014-06-05
KUO, HUNG-JUI
Executed: 2014-06-05
LIU, CHUNG-SHI
Executed: 2014-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD., 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Structure in Wafer Level Package