Assignment of Assignor's Interest

Recorded: 2016-02-18 Pages: 3

Assignor

NEC CORPORATION

Executed: 2016-02-16

Assignee

NEC PLATFORMS, LTD

2-6-1, KITAMIKATA, TAKATSU-KU, KAWASAKI-SHI, KANAGAWA, 2138511, JAPAN

Covered Property (1)

Method of Manufacturing a Three-Dimensional Packaging Semiconductor Device

Patent: 8,956,915 →

Application: 13/680,975 →

Publication: US 2013/0078764

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.