Method of manufacturing a three-dimensional packaging semiconductor device
Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a second face; a plurality of memory devices and passive components; a supporter which is provided with a groove on one face; and a computing processor device. The memory devices and the passive components are connected to the first external electrode, the one face of the supporter is bonded on the first face of the flexible circuit board so that the groove houses the memory devices and the passive components. The flexible circuit board is bent along a perimeter of the supporter to be wrapped around a side face and another face of the supporter. On the flexible circuit board, the second external electrode is provided on the second face which is opposite to the first external electrode, and the third external electrode is provided on the second face which is bent to the another face of the supporter. The computing processor device is connected to the second external electrode, and a bump is formed on the third external electrode.
1. A method of manufacturing a semiconductor device, comprising:
a step (a) of mounting a first electronic part to one face of a flexible circuit board;
a step (b) of mounting a supporter, which includes a groove that houses the first electronic part, to the one face of the flexible circuit board which faces the supporter so as to enclose the first electronic part, the supporter having a back surface opposite to the groove;
a step (c) of bending the flexible circuit board along a perimeter of the supporter to be wrapped around at least one side face of the supporter and at least a portion of a face of the supporter that is opposite to a face where the groove is formed, and adhering the flexible circuit board to at least the portion of the face of the supporter;
a step (d) of mounting a second electronic part to a face of the flexible circuit board that is opposite to the one face where the first electronic part is mounted; and
a step (e) of forming a solder bump on a portion of the flexible circuit board that is adhered to the face of the supporter that is opposite to the face where the groove is formed.
2. A method of manufacturing a semiconductor device according to claim 1 , wherein a combination the step (a) and the step (b), or a combination of the step (d) and the step (e), are executed simultaneously.