Patent Assignment
Reel/Frame 037783/0021
Assignment of Assignor's Interest
Recorded: 2016-02-22
Pages: 12
Assignors
CHENG, SHYH-WEI
Executed: 2016-01-22
WANG, CHIH-YU
Executed: 2016-01-22
HSU, HSI-CHENG
Executed: 2016-01-22
CHIANG, JI-HONG
Executed: 2016-01-22
WENG, JUI-CHUN
Executed: 2016-02-19
LIN, SHIUAN-JENG
Executed: 2016-01-22
WU, WEI-DING
Executed: 2016-01-22
HU, CHING-HSIANG
Executed: 2016-01-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Inter-Poly Connection for Parasitic Capacitor and Die Size Improvement