Patent Assignment
Reel/Frame 037790/0662
Assignment of Assignor's Interest
Recorded: 2016-02-22
Pages: 4
Assignee
MITSUBISHI MATERIALS CORPORATION
3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Bonded Body and Power Module Substrate