Assignment of Assignor's Interest

Recorded: 2016-02-23 Pages: 3

Assignor

KOHIKI, MICHIYA

Executed: 2016-02-01

Assignee

1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN

Covered Property (1)

Copper Foil Provided with Carrier, Laminate, Printed Wiring Board, Electronic Device and Method for Fabricating Printed Wiring Board

Patent: 9,839,124 →

Application: 15/015,551 →

Publication: US 2016/0234935

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.