Patent Assignment
Reel/Frame 037843/0797
Assignment of Assignor's Interest
Recorded: 2016-02-26
Pages: 4
Assignors
LU, CHI-MING
Executed: 2016-01-07
HUANG, CHIH-HUI
Executed: 2016-01-07
TSAO, JUNG-CHIH
Executed: 2016-01-07
LIANG, YAO-HSIANG
Executed: 2016-01-07
HUANG, CHIH-CHANG
Executed: 2016-01-07
HSU, CHING-HO
Executed: 2016-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Deep Trench Isolation in Radiation Sensing Substrate and Image Sensor Device