Patent Assignment
Reel/Frame 037860/0643
Assignment of Assignor's Interest
Recorded: 2016-03-01
Pages: 3
Assignors
CHANG, CHIH-HORNG
Executed: 2014-10-07
KUO, TIN-HAO
Executed: 2014-10-07
CHEN, CHEN-SHIEN
Executed: 2014-10-07
LIN, YEN-LIANG
Executed: 2014-10-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Bump Structure Having a Side Recess and Semiconductor Structure Including the Same