Patent Assignment
Reel/Frame 037887/0142
Assignment of Assignor's Interest
Recorded: 2016-03-03
Pages: 4
Assignors
CHEN, YING-JU
Executed: 2016-02-05
SU, AN-JHIH
Executed: 2016-02-06
CHEN, HSIEN-WEI
Executed: 2016-02-18
YEH, DER-CHYANG
Executed: 2016-02-18
WU, CHI-HSI
Executed: 2016-02-18
YU, CHEN-HUA
Executed: 2016-02-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Underfill Control Structures and Method