IP Library › Assignment 037888/0612
Patent Assignment
Reel/Frame 037888/0612

Assignment of Assignor's Interest

Recorded: 2016-03-03 Pages: 4
Assignors
BURMEISTER, FRANK
Executed: 2016-02-29
LEUNG, CHI HO
Executed: 2016-02-29
LI, ZHIGANG
Executed: 2016-03-01
ZHAO, YUJUN
Executed: 2016-03-01
KIRCHHEIMER, KAREN
Executed: 2016-02-29
RITTER, HANS-MARTIN
Executed: 2016-02-29
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, NL-5656 AG, NETHERLANDS
Covered Property (1)
Overmolded Chip Scale Package
Application: 15/060,548 →
Publication: US 2017/0256432
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
Release of Security Interest Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →