Patent Assignment
Reel/Frame 037895/0270
Assignment of Assignor's Interest
Recorded: 2016-03-04
Pages: 10
Assignors
KIM, SUNG-MIN
Executed: 2016-02-17
PAAK, SUNHOM STEVE
Executed: 2016-02-16
SHIN, HEON-JONG
Executed: 2016-02-16
CHA, DONG-HO
Executed: 2016-02-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices and Methods of Forming the Same