Patent Assignment
Reel/Frame 037896/0940
Assignment of Assignor's Interest
Recorded: 2016-02-23
Pages: 3
Assignor
TAN, XIAOCHUN
Executed: 2016-02-03
Assignee
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.
A1501 TECHNOLOGY MANSION, NO. 90 WENSAN ROAD, HANGZHOU, ZHEJIANG PROVINCE, 310012, CHINA
Covered Property
(1)
Chip Package Structure and Manufacturing Method Therefor