Patent Assignment
Reel/Frame 037899/0129
Assignment of Assignor's Interest
Recorded: 2016-03-04
Pages: 13
Assignors
HANSEN, DARREN
Executed: 2015-01-14
LOBODA, MARK
Executed: 2015-01-08
MANNING, IAN
Executed: 2015-01-22
MOEGGENBORG, KEVIN
Executed: 2015-01-12
MUELLER, STEPHAN
Executed: 2015-01-17
PARFENIUK, CHRISTOPHER
Executed: 2015-01-12
QUAST, JEFFREY
Executed: 2015-01-12
TORRES, VICTOR
Executed: 2015-02-06
WHITELEY, CLINTON
Executed: 2015-01-12
Assignee
DOW CORNING CORPORATION
2200 WEST SALZBURG ROAD, MIDLAND, MICHIGAN, 48686-0994
Covered Property
(1)
Method for Manufacturing Sic Wafer Fit for Integration with Power Device Manufacturing Technology
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Feb 28, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045470/0188 →
Assignment of Assignor's Interest
Sep 5, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 050296/0365 →
Assignment of Assignor's Interest
Mar 30, 2020
From: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
To: SK SILTRON CSS, LLC
Reel/Frame 052264/0831 →
Intellectual Property Security Agreement
Nov 25, 2024
From: SK SILTRON CSS, LLC
To: CITIBANK, N.A.
Reel/Frame 069440/0523 →