Patent Assignment
Reel/Frame 052264/0831
Assignment of Assignor's Interest
Recorded: 2020-03-30
Pages: 21
Assignor
DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Executed: 2020-02-27
Assignee
SK SILTRON CSS, LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties
(29)
Method of Manufacturing Substrates Having Improved Carrier Lifetimes
Application:
12/373,145 →
Publication:
US 2010/0006859
Method to Manufacture Large Uniform Ingots of Silicon Carbide by Sublimation/Condensation Processes
Method of Reducing Memory Effects in Semiconductor Epitaxy
Method of Manufacturing Substrates Having Improved Carrier Lifetimes
Method to Reduce Dislocations in Sic Crystal Growth
High Voltage Power Semiconductor Devices on Sic
Flat Sic Semiconductor Substrate
A Method for Growing a Sic Crystal by Vapor Deposition Onto a Seed Crystal Provided on a Supporting Shelf Which Permits Thermal Expansion
A Method for Growing a Sic Crystal by Vapor Deposition Onto a Seed Crystal Provided on a Support Shelf Which Permits Thermal Expansion
SiC SUBSTRATE WITH SiC EPITAXIAL FILM
High Voltage Power Semiconductor Device on Sic
Method for Manufacturing Sic Wafer Fit for Integration with Power Device Manufacturing Technology
Flat Sic Semiconductor Substrate
Method for Manufacturing Sic Wafer Fit for Integration with Power Device Manufacturing Technology
Graphite Crucible for Sublimation Growth of Sic Crystal
Reaction Cell for Growing Sic Crystal with Low Dislocation Density
Furnace for Seeded Sublimation of Wide Band Gap Crystals
Furnace for Seeded Sublimation of Wide Band Gap Crystals
Method of manufacturing substrates having improved carrier lifetimes
Application:
60/831,839 →
Method to Manufacture Large Uniform Ingots of Silicon Carbide by Sublimation/Condensation Processes
Application:
61/013,083 →
Method of Reducing Memory Effects in Semiconductor Epitaxy
Application:
61/058,660 →
High Voltage Power Semiconductor Devices on Sic
Application:
61/699,797 →
Flat Sic Semiconductor Substrate
Application:
61/719,310 →
Method to Reduce Dislocations in Sic Crystal Growth
Application:
61/761,165 →
Sic Crystal and Wafer Cut from Crystal with Low Dislocation Density
Application:
61/761,171 →
Sic Crystal with Low Dislocation Density
Application:
61/761,179 →
SiC SUBSTRATE WITH SiC EPITAXIAL FILM
Application:
61/798,819 →
Large Diameter Semiconductor Wafer for Integration with Power Device Manufacturing Technology
Application:
62/030,490 →
Furnace for Seeded Sublimation of Wide Band Gap Crystals
Application:
62/112,622 →
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 8, 2013
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 030754/0024 →
Assignment of Assignor's Interest
Aug 6, 2013
From: LOBODA, MARK; PARFENIUK, CHRISTOPHER
To: DOW CORNING CORPORATION
Reel/Frame 030947/0925 →
Assignment of Assignor's Interest
Aug 6, 2013
From: LOBODA, MARK; CHUNG, GILYONG
To: DOW CORNING CORPORATION
Reel/Frame 030947/0815 →
Assignment of Assignor's Interest
Aug 9, 2013
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 030982/0553 →
Assignment of Assignor's Interest
Oct 18, 2013
From: LOBODA, MARK; DRACHEV, ROMAN; HANSEN, DARREN; SANCHEZ, EDWARD
To: DOW CORNING CORPORATION
Reel/Frame 031439/0579 →
Assignment of Assignor's Interest
Dec 8, 2014
From: LOBODA, MARK; ZHANG, JIE
To: DOW CORNING CORPORATION
Reel/Frame 034424/0661 →
Assignment of Assignor's Interest
Feb 9, 2015
From: HANSEN, DARREN; LOBODA, MARK; MANNING, IAN; MOEGGENBORG, KEVIN
To: DOW CORNING CORPORATION
Reel/Frame 034923/0503 →
Assignment of Assignor's Interest
Mar 12, 2015
From: LOBODA, MARK; CHUNG, GILYONG
To: DOW CORNING CORPORATION
Reel/Frame 035151/0717 →
Assignment of Assignor's Interest
Jul 13, 2015
From: LOBODA, MARK; PARFENIUK, CHRISTOPHER
To: DOW CORNING CORPORATION
Reel/Frame 036072/0658 →
Assignment of Assignor's Interest
Mar 4, 2016
From: HANSEN, DARREN; LOBODA, MARK; MANNING, IAN; MOEGGENBORG, KEVIN
To: DOW CORNING CORPORATION
Reel/Frame 037899/0129 →
Assignment of Assignor's Interest
Jan 30, 2017
From: LOBODA, MARK; DRACHEV, ROMAN; HANSEN, DARREN; SANCHEZ, EDWARD
To: DOW CORNING CORPORATION
Reel/Frame 041126/0748 →
Assignment of Assignor's Interest
Jan 31, 2017
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 041138/0670 →
Assignment of Assignor's Interest
Aug 1, 2017
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 043161/0759 →
Change of Name
Feb 27, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045460/0278 →
Change of Name
Feb 28, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045470/0188 →
Assignment of Assignor's Interest
Sep 5, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 050296/0365 →
Assignment of Assignor's Interest
Nov 14, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 051006/0041 →
Assignment of Assignor's Interest
Nov 14, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 051005/0941 →
Assignment of Assignor's Interest
Nov 14, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 051005/0628 →
Assignment of Assignor's Interest
Mar 12, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 052162/0001 →
Intellectual Property Security Agreement
Nov 25, 2024
From: SK SILTRON CSS, LLC
To: CITIBANK, N.A.
Reel/Frame 069440/0523 →