Flat SiC semiconductor substrate
Methods for manufacturing silicon carbide wafers having superior specifications for bow, warp, total thickness variation (TTV), local thickness variation (LTV), and site front side least squares focal plane range (SFQR). The resulting SiC wafer has a mirror-like surface that is fit for epitaxial deposition of SiC. The specifications for bow, warp, total thickness variation (TTV), local thickness variation (LTV), and site front side least squares focal plane range (SFQR) of the wafer are preserved following the addition of the epitaxy layer.
1. A substrate comprising a polished silicon carbide wafer of a diameter from 76 mm to 150 mm, and having a back surface and a front surface, the front surface conditioned for epitaxial deposition, wherein the polished silicon carbide wafer has local thickness variation (LTV) of 0.1 to 1.5 μm and site front side least squares focal plane range (SFQR) of 0.01 to 0.3 μm, based on a one square cm site size.
2. The substrate of claim 1 , wherein the front surface has rms roughness of Rq<15 Å.
3. The substrate of claim 1 , wherein the substrate has a total thickness variation (TTV) in the range 0.1 to 5 μm.
4. The substrate of claim 1 , wherein the substrate further has warp of 0.1 to 35 μm.
5. A single-crystal silicon carbide substrate comprising a back surface and a front surface, the front surface having an epitaxial layer of SiC grown thereupon, the substrate with the epitaxial layer exhibiting local thickness variation (LTV) of 0.1 to 1.8 μm and site front side least squares focal plane range (SFQR) of 0.01 to 0.45 μm, based on a one square cm site size.
6. The substrate of claim 5 , wherein the substrate with the epitaxial layer further simultaneously exhibiting total thickness variation (TTV) of 0.1 to 6 μm and warp of 0.1 to 40 μm.
7. The substrate of claim 5 , wherein the root mean square roughness value Rq of the front surface is less than 2 nm as measured on a 2.0×2.0 μm site size.
8. The single-crystal silicon carbide substrate of claim 5 , wherein the substrate simultaneously exhibits total thickness variation (TTV) 0.1 to 5 μm, warp of 0.1 to 35 μm, local thickness variation (LTV) 0.1 to 1.5 μm, and site front side least squares focal plane range (SFQR) of 0.01 to 0.3 μm, based on a one square cm site size.