IP Library › Patent Application 61761171
Patent Application Provisional
App. No. 61/761,171 · Confirmation No. 4314

SIC CRYSTAL AND WAFER CUT FROM CRYSTAL WITH LOW DISLOCATION DENSITY

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2013-02-20 APP.FILE.REC Filing Receipt 3 View
2013-02-05 ADS Application Data Sheet 7 View
2013-02-05 SPEC Specification 15 View
2013-02-05 CLM Claims 4 View
2013-02-05 ABST Abstract 1 View
2013-02-05 DRW.NONBW Drawings-other than black and white line drawings 4 View
2013-02-05 WFEE Fee Worksheet (SB06) 2 View
2013-02-05 N417 Electronic Filing System Acknowledgment Receipt 3 View
2013-02-05 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/761,171
Filed
2013-02-05