IP Library Patent Application 12373145
Patent Application
App. No. 12/373,145

Method of Manufacturing Substrates Having Improved Carrier Lifetimes

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
12/373,145
Abstract

This invention relates to a method for depositing silicon carbide material onto a substrate such that the resulting substrate has a carrier lifetime of 0.5-1000 microseconds, the method comprising a. introducing a gas mixture comprising a chlorosilane gas, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a substrate; and b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.; with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr. This invention also relates to a method for depositing silicon carbide material onto a substrate such that the resulting substrate has a carrier lifetime of 0.5-1000 microseconds, the method comprising a. introducing a gas mixture comprising a non-chlorinated silicon-containing gas, hydrogen chloride, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a substrate; and b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.; with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr.

Claims (20)

1 . A method for depositing silicon carbide coating onto a substrate such that the resulting coating has a carrier lifetime of 0.5-1000 microseconds, the method comprising

a. introducing a gas mixture comprising a chlorosilane gas, wherein the chlorosilane gas is dichlorosilane gas, methylhydrogendichlorosilane gas, dimethyldichlorosilane gas, or mixtures thereof, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a single crystal silicon carbide substrate;

b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.;

with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr.

2 . A method according to claim 1 wherein the gas mixture further comprises a doping gas.

3 . A method according to claim 2 wherein the doping gas is nitrogen gas, phosphine gas, or trimethylaluminum gas.

4 . (canceled)

5 . A method according to claim 1 , wherein the carbon-containing gas has the formula H a C b Cl c , where a and b are greater than zero, and c is greater than or equal to zero.

6 . A method according to claim 1 wherein the carbon-containing gas is C 3 H 8 gas, C 2 H 6 gas, CH 3 Cl gas, or CH 3 CH 2 CH 2 Cl gas.

7 . A product produced in accordance with the method of claim 1 .

8 . (canceled)

9 . (canceled)

10 . (canceled)

11 . (canceled)

12 . (canceled)

13 . (canceled)

14 . (canceled)

15 . (canceled)

16 . (canceled)

17 . (canceled)

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2020
From: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
To: SK SILTRON CSS, LLC
Reel/Frame 052264/0831 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 051005/0628 →